Electronics & 3C Inspection Optics: Small Parts, High Takt, Zero Escapes
3C inspection lives at the intersection of miniature geometry and brutal takt: 0201-and-smaller SMD parts, connector pin coplanarity, and high-density boards that must be covered without vignetting — all at AOI line speed. A lens that resolves the part but distorts the field turns good boards into false rejects.
Optical recipe & specs
Mapped Product Lines
Embedded smart cameras and compact heads where board space is priced per square millimeter (H05–H16 focal range, NIR/VIS configurations, FT thread-locked focus against line vibration).
Large-target AOI optics with distortion below 0.05% and 10K+ batch consistency.
Panel-width boards and flexible circuits under continuous motion.
Non-standard sensor formats and mechanical envelopes.
| Metric | Value | Source Line |
|---|---|---|
| Distortion | < 0.05% | FA |
| Batch consistency | 10K+ batches | FA |
| Image circle | 2/3″ – 1.1″ | FA |
| Focus lock under vibration | FT full-thread | M12 |
| Task | Optical Driver | Recommended Line |
|---|---|---|
| SMD presence & polarity (0201) | Resolution at WD | M12 / FA |
| Connector pin geometry | Low distortion | FA / Telecentric ˆ |
| Solder bridge on dense PCB | Contrast + DOF | FA |
| Panel-width FPC scan | Wide line coverage | Line scan |
